Kingston Technology Corp. KSM56R46BD8PMI-48MBI 48GB DDR5-5600 CL46 2Rx8 Registered server RAM
- 48 GB
- DDR5 5600
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256GB DDR5 4800 ECC registered DIMM for servers, 1.1V CL40, 288-pin, 8-rank 3DS
This A-Tech module delivers 256GB of DDR5 4800 registered ECC memory in a single 288-pin DIMM. It runs at 1.10V with CL40 latency and uses an 8Rx4 3DS TSV rank configuration. The part is built as a compatible replacement for Hynix HMCT14MEERA, HMCT14MEERA155N and HMCT14MEERA157N server DIMMs.
Server and workstation integrators who need a single high-capacity registered ECC module to match the listed Hynix part numbers will find this drop-in replacement validated for those systems. Buyers who require non-ECC memory, unbuffered DIMMs, consumer desktop compatibility or lower-capacity modules should select a different product.
The DDR5 4800 PC5-38400 designation is the decisive specification; the module must be installed in a platform that supports this exact data rate and registered ECC signalling. Verify your system documentation for PC5-38400 RDIMM support before ordering.
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| Product | |
|---|---|
| Brand name | A-Tech |
| Product line | Compatible Replacement for Hynix |
| Model name | HMCT14MEERA, HMCT14MEERA155N, HMCT14MEERA157N |
| Total capacity | 256 GB |
| Performance | |
| Rated speed | DDR5 4800 (PC5 38400) |
| Processor | |
| Chipset | Major Brand Chipset |
| Memory | |
| CAS latency | CL40 |
| ECC support | Yes |
| Buffer type | Registered |
| Memory rank | 2S4Rx4 (8Rx4 EC8) |
| Power | |
| Rated voltage | 1.1 V |
Align the key notch with the motherboard slot, press firmly until both retention clips click, then verify the system registers the full 256 GB at 4800 MT/s in BIOS; the step often missed is enabling the correct memory profile so the module runs at its rated 1.1 V and CL40 timing.
No scheduled maintenance is required; the module uses major-brand DRAM chips and on-die ECC to correct single-bit errors, so replacement is only needed if the system logs uncorrectable multi-bit failures or if a capacity upgrade is desired later.
The thermal envelope of the 8-rank 3DS/TSV stack is the first constraint; prolonged heavy traffic can raise chip temperatures enough to trigger throttling unless the server chassis provides adequate airflow across the 1.1 V modules.
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