IBM 46W2843 Xeon E5-2680 v2 10-core 2.80 GHz server processor
- DDR3 1866
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12-core server processor with 24 threads, 2.9 GHz base clock, 64 MB L3 cache and 128 PCIe 4.0 lanes for high-density workloads
The AMD EPYC 7272 is a 12-core, 24-thread CPU designed for Socket SP3 platforms. It operates at a base frequency of 2.9 GHz with a maximum boost of 3.2 GHz. The processor features 64 MB of L3 cache and 6 MB of L2 cache, built on 7 nm process technology. It supports 8-channel DDR4-3200 memory and provides 128 lanes of PCIe 4.0 connectivity. This OEM part is sold without a cooling device.
This processor fits virtualisation hosts, hyper-converged nodes and compute clusters that benefit from high core counts and wide memory bandwidth within a 120 W thermal envelope. The 8-channel memory architecture and 128 PCIe 4.0 lanes help reduce I/O bottlenecks in storage-heavy or GPU-accelerated deployments. Buyers who require higher per-core frequencies for lightly threaded applications or who need a processor with an included cooler should consider other options.
The processor installs exclusively into a Socket SP3 motherboard with appropriate BIOS support for the EPYC 7002 series. No other socket type will accept this chip. Verify platform qualification before purchase.
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| Product | |
|---|---|
| Brand name | AMD |
| Product line | AMD EPYC 7002 |
| Model name | 100-000000079 |
| Product name | EPYC 7272 |
| Performance | |
| Working frequency | 2.9 GHz |
| Processor | |
| CPU cores | 12-Core |
| CPU socket | Socket SP3 |
| Maximum turbo clock | 3.2 GHz |
| TDP rating | 120 W |
| CPU threads | 24 |
| Level 3 cache | 64 MB |
| 64-bit capable | Yes |
| Process node | 7 nm |
| Virtualization support | Yes |
| Maximum PCIe lanes | 128 |
| Memory | |
| Supported memory speed | DDR4 3200 |
| Channel configuration | 8 Channel |
| Ports & slots | |
| PCIe generation | 4.0 |
| Size & build | |
| Shipping weight | 0.45 kg |
| Package size | 203 × 127 × 76 mm |
| In the box | |
| Included cooler | Not included - Processor Only |
Align the gold triangle on the processor with the socket corner, lower the retention frame, then torque the captive screws in a cross pattern to the board-specified value; skipping the cross-pattern sequence is the common error that causes uneven contact.
The thermal interface material between the CPU lid and heatsink should be refreshed every two to three years; the processor itself has no user-replaceable parts and no moving components.
The 120 W thermal design power is reached first; the VRM and cooler must dissipate that heat continuously or the firmware will throttle clocks below the 3.2 GHz maximum turbo frequency.
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