IBM 46W2843 Xeon E5-2680 v2 10-core 2.80 GHz server processor
- DDR3 1866
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24-core server processor running at 2.8 GHz with 128 MB L3 cache and DDR4 3200 eight-channel memory support
The AMD EPYC 7402 is a 24-core Socket SP3 CPU built for dual-processor servers and high-thread workloads such as virtualisation, database hosting and rendering. It runs at 2.8 GHz base with a 3.35 GHz maximum turbo and provides 128 MB of L3 cache alongside 48 threads. The 7 nm process helps keep the thermal design power at 180 W.
This part targets administrators who need 128 PCIe 4.0 lanes and eight DDR4 3200 channels across two sockets for memory-heavy clusters or storage nodes. Builders looking for higher per-core frequency or a lower power envelope for single-socket workstations should evaluate other options.
The processor fits Socket SP3 platforms and exposes up to 128 lanes of PCI Express 4.0 for add-in cards and storage controllers. A compatible cooler rated for 180 W TDP must be sourced separately as no cooling device is included.
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| Product | |
|---|---|
| Brand name | AMD |
| Product line | AMD EPYC 7002 |
| Model name | 100-000000046 |
| Product name | EPYC 7402 |
| Performance | |
| Working frequency | 2.8 GHz |
| Processor | |
| CPU cores | 24-Core |
| CPU socket | Socket SP3 |
| Maximum turbo clock | 3.35 GHz |
| TDP rating | 180 W |
| CPU threads | 48 |
| Level 3 cache | 128 MB |
| 64-bit capable | Yes |
| Maximum PCIe lanes | 128 |
| Memory | |
| Supported memory speed | DDR4 3200 |
| Channel configuration | 8 Channel |
| Ports & slots | |
| PCIe generation | 4.0 |
| Size & build | |
| Shipping weight | 0.57 kg |
| Package size | 305 × 229 × 102 mm |
| In the box | |
| Included cooler | Not included - Processor Only |
Align the gold triangle on the processor with the socket triangle, lower the retention frame, then torque the captive screws in a cross pattern to the board vendor's specified value; skipping the cross-pattern torque sequence is the step most often done wrong.
The processor itself has no serviceable parts; plan to replace the thermal interface material whenever the cooler is removed, and verify that the platform firmware supports the 7402 before deployment.
The 180W thermal design power is the first limit; the socket and cooler must dissipate that heat continuously or the processor will throttle to stay within its thermal envelope.
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