IBM 46W2843 Xeon E5-2680 v2 10-core 2.80 GHz server processor
- DDR3 1866
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64-core server processor with 2.0 GHz base clock, 3.35 GHz boost, 256 MB L3 cache, eight-channel DDR4-3200 support and 128 PCIe 4.0 lanes
The AMD EPYC 7702 is a 64-core, 128-thread server processor built on 7 nm process technology. It targets data-centre operators who need maximum thread density for virtualisation, cloud workloads and high-performance computing. The OEM package contains the processor only.
This CPU requires a Socket SP3 platform and delivers 128 lanes of PCI Express 4.0 connectivity. The eight-channel DDR4-3200 memory controller supports large memory footprints. A 200 W thermal design power demands adequate cooling infrastructure, which is not included.
The processor ships without a cooling device, so integrators must supply a compatible SP3 heatsink or liquid block. No management software or licence keys are included in the package. Buyers who need a pre-applied thermal solution or bundled orchestration tools should look elsewhere.
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| Product | |
|---|---|
| Brand name | AMD |
| Product line | AMD EPYC 7002 |
| Model name | 100-000000038 |
| Product name | EPYC 7702 |
| Performance | |
| Working frequency | 2.0 GHz |
| Processor | |
| CPU cores | 64-Core |
| CPU socket | Socket SP3 |
| Maximum turbo clock | 3.35 GHz |
| TDP rating | 200 W |
| CPU threads | 128 |
| Level 3 cache | 256 MB |
| Maximum PCIe lanes | 128 |
| Memory | |
| Supported memory speed | DDR4 3200 |
| Channel configuration | 8 Channel |
| Ports & slots | |
| PCIe generation | 4.0 |
| Size & build | |
| Shipping weight | 1.97 kg |
| Package size | 203 × 127 × 76 mm |
| In the box | |
| Included cooler | Not included - Processor Only |
The 64 cores and 128 threads allow the processor to handle many virtual machines, containers or high-performance computing tasks simultaneously, improving throughput for heavily parallel workloads.
PCIe 4.0 provides double the bandwidth per lane of the previous generation, and 128 lanes give ample connectivity for multiple GPUs, high-speed storage arrays and network adapters without bottlenecks.
The chip uses the SP3 socket and has a 200 W TDP; a compatible server board and a cooling solution rated for at least 200 W are required, as no cooler is included.
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