AMD EPYC 9535 64-Core 2.4 GHz Server Processor 100-000001147
- EPYC 9535
- 64-Core
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Quad-core server processor with 3.1 GHz base clock, 4.60 GHz turbo, 8 MB L3 cache and integrated UHD Graphics P750 for LGA 1200 platforms
The Intel Xeon E-2324G is a quad-core server processor built for LGA 1200 platforms. It runs at a 3.10 GHz base frequency and reaches a 4.60 GHz maximum turbo frequency. The chip includes 8 MB of L3 cache and integrates Intel UHD Graphics P750. A 65 W thermal design power rating defines its cooling requirement.
This processor suits single-socket servers and workstations that need ECC memory support and integrated graphics for display output. It fits builds limited to a 65 W power envelope and dual-channel DDR4 3200 memory. Buyers needing multi-socket scalability, Hyper-Threading, or more than four threads should look at other Xeon models.
The LGA 1200 socket and dual-channel DDR4 3200 memory controller determine motherboard compatibility. The processor supports up to 128 GB of memory across two channels. A discrete cooler is required because none is included in the retail package.
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| Product | |
|---|---|
| Brand name | Intel |
| Product line | Intel Xeon E |
| Model name | BX80708E2324G |
| Product name | Xeon E-2324G |
| Performance | |
| Working frequency | 3.1 GHz |
| Maximum dynamic frequency | 1.3 GHz |
| Processor | |
| CPU cores | Quad-Core |
| CPU socket | LGA 1200 |
| Maximum turbo clock | 4.6 GHz |
| TDP rating | 65 W |
| Processor codename | Rocket Lake |
| CPU threads | 4 |
| Level 3 cache | 8 MB |
| 64-bit capable | Yes |
| Hyper-Threading | No |
| Process node | 14 nm |
| Virtualization support | Yes |
| CPU socket scalability | 1S Only |
| Maximum PCIe lanes | 20 |
| Memory | |
| Supported memory speed | DDR4 3200 |
| Max supported memory | 128 GB |
| Channel configuration | Dual Channel |
| Graphics | |
| Built-in graphics | Intel UHD Graphics P750 |
| GPU base clock | 350 MHz |
| Ports & slots | |
| PCIe generation | 4.0 |
| Size & build | |
| Shipping weight | 0.23 kg |
| Package size | 203 × 127 × 127 mm |
| In the box | |
| Included cooler | Not included - Processor Only |
Align the processor notches with the socket keys, lower it gently without force, then secure the retention lever; the 14 nm Rocket Lake die sits directly under the integrated heat spreader so uneven pressure can damage contacts.
The 65 W thermal design power needs a compatible LGA 1200 cooler rated for at least that dissipation; the retail pack ships without a cooling device so you must supply one before first boot.
The 65 W power limit and 14 nm process constrain all-core turbo duration; sustained workloads will drop toward the 3.10 GHz base frequency once the package hits its thermal envelope.
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