Bitspower Baircool TP-1 Thermal Paste 2.5g

Bitspower Baircool TP-1 Thermal Paste

This non-silicone thermal compound delivers a thermal conductivity of 6.5 W/m-K and a thermal impedance of 0.009 K-in2/W. It spreads easily and evenly without requiring special storage conditions. The gray grease is non-corrosive, non-electrically conductive, and requires no burn-in time. It offers excellent long-term stability with low dry-out characteristics.

Builders needing reliable CPU or GPU heat transfer

The 2.5 g syringe suits standard desktop processor applications and routine maintenance. Users requiring electrically conductive paste or larger volumes for multiple builds should look elsewhere. The compound is not intended for sub-ambient cooling scenarios or extreme overclocking setups demanding specialised liquid-metal interfaces. It also lacks specific certifications for industrial or server-grade validation.

2.5 g capacity covers several standard applications

A typical CPU installation uses a pea-sized drop, so the syringe provides enough material for multiple reseats or a small batch of builds. Viscosity below 600,000 CPS ensures consistent spreading without excessive force. The dielectric strength of 0.9 KV/mm confirms electrical isolation for safe use around exposed components. Specific gravity of 2.5 g/cm3 indicates a dense, stable paste that resists pump-out over time.