Arctic Silver AS5-3.5G thermal paste 3.5g tube
- 3.5g
- -50 to 130 °C
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Non-silicone thermal compound with 6.5 W/m-K conductivity, 0.009 K-in²/W impedance, easy application and no burn-in required
This non-silicone thermal compound delivers a thermal conductivity of 6.5 W/m-K and a thermal impedance of 0.009 K-in2/W. It is non-corrosive and non-electrically conductive for safe application on CPUs and GPUs. The grey grease offers excellent long-term stability with low dry-out characteristics. No burn-in time is required after installation.
The paste spreads easily and evenly during installation, requiring only a relatively small amount per application. Its viscosity is rated below 600,000 CPS for consistent coverage. No special storage conditions are needed to maintain the compound's properties over time. The dielectric strength is rated at 0.9 KV/mm for electrical insulation.
The 5-gram syringe covers a limited number of applications, so users planning multiple system builds may need additional units. The specific gravity of 2.5 g/cm3 indicates a dense compound optimised for thin bond lines. Buyers requiring electrically conductive paste or higher volume packaging should consider alternative products.
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| Product | |
|---|---|
| Brand name | Bitspower |
| Model name | BPA-TP1-5G |
| Product type | CPU Block |
The compound specifies a thermal impedance of 0.009 K-in2/W, so sustained use adds minimal resistance between the die and cold plate.
Low dry-out and non-corrosive formulation keep the interface stable without pump-out, so temperatures and fan noise stay consistent during continuous operation.
Any standard CPU block or air cooler that accepts manual paste application will work; the compound itself needs no special brackets or tools.
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