Cooler Master E1 IC Essential Thermal Paste 1.5 ml

Cooler Master E1 IC Essential Thermal Paste 1.5 ml

Cooler Master E1 IC Essential Thermal Paste is a high-density compound designed for CPU and GPU heat-sink interfaces. The 1.5 ml syringe supplies enough material for several applications. It is electrically non-conductive, non-curing, non-capacitive and non-corrosive, making it safe for direct die contact. A scraper and grease cleanser pack are included for preparation and clean-up.

Thermal conductivity over 4.5 W/m-K

The key specification is thermal conductivity rated above 4.5 W/m-K at 25 °C. This value determines how effectively heat moves from the processor lid into the cooler base. Thermal impedance is specified below 0.185 °C-in²/W, indicating low resistance across the bond line. Volume resistivity reaches 1.0E+10 ohm-cm, confirming electrical isolation. Specific gravity measures 2.5, reflecting the dense particle loading that enables the high conductivity.

Low thermal resistance in normal use

In typical operation the paste remains stable without curing, so thermal resistance does not increase over time. The non-capacitive and non-corrosive formulation protects surrounding components while maintaining consistent contact. Because the compound is electrically non-conductive, accidental overflow onto the substrate or socket area will not cause shorts. The included cleanser simplifies removal during maintenance or upgrades.