Arctic Silver AS5-3.5G thermal paste 3.5g tube
- 3.5g
- -50 to 130 °C
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Grey silicone thermal compound rated above 1.93 W/m·K, supplied in a 30 g syringe for CPU and graphics-card heatsinks, usable from –30 °C to 280 °C
Corn Electronics 30g Grey Thermal Paste is a silicone-based compound designed for processor and graphics card heatsinks. The non-toxic and odourless formula ensures safe handling during application. A syringe design allows precise placement on the die or heat spreader. It suits builders assembling or maintaining desktop systems.
Thermal conductivity exceeds 1.93W/m-K to transfer heat away from the component efficiently. The paste remains stable across an operating range from -30 to 280 °C. This headroom covers typical desktop loads and sustained gaming sessions. Extreme sub-ambient cooling or continuous industrial workloads beyond this range are not supported.
Silicone compounds can dry out over very long periods, eventually increasing thermal impedance. The 30g volume covers multiple applications but may be excessive for a single laptop repaste. Users requiring metal-based conductivity or phase-change materials should consider alternative product types. Application technique still affects the final interface quality.
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The grey silicone compound fills microscopic gaps on any metal base, and the syringe design lets you spread a thin, even layer on uneven surfaces.
Monitor CPU or GPU core temperatures under load; they should stabilise well below the 280 °C operating limit, confirming effective heat transfer.
The package contains only the 30 g syringe of grey thermal paste; any spreader or cleaning wipes must be purchased separately.
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