CS Labs K5 PRO 20g Viscous Thermal Paste

Thermal pad replacement paste

CS Labs K5 PRO is a viscous thermal compound designed to replace soft thermal pads on memory chips and similar components. The gummy consistency allows direct application where pads up to 1 mm thick are normally used and can fill gaps up to 3 mm. It is supplied as a 20 g packet with a wood spatula and instructions, yielding roughly 20 to 40 applications. The paste is non electrically conductive and has no expiration date when stored sealed and protected from frost.

Sustained load behaviour

Thermal conductivity is rated above 5 3 W/m·K, at least three times higher than common pads used in consumer electronics. The operational temperature range spans from -90 °C to 250 °C, so the material remains stable during extended high temperature operation. Because it does not dry out, thermal resistance stays consistent over long periods without the pump out effect seen in conventional greases. Infinite storage and service life are claimed by the manufacturer.

Practical limits of the interface

The compound suits components originally fitted with soft pads up to 1 mm thick and can bridge larger gaps up to 3 mm, but it is not a substitute for thin high pressure paste layers on bare dies. Compatibility examples listed include RTX 3080, 3090 and 2080 Ti graphics cards as well as various laptops and consoles. Buyers who need a traditional low viscosity paste for CPU dies or who require a specific pad thickness not covered by the 1 to 3 mm range should look elsewhere.