STARTECH SILVGREASE1 1.5g thermal paste
- 1.5g
- 1.93 W/mK
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A 20 g ceramic-based thermal compound rated at 1.06 W/mK that fills microscopic gaps between a CPU and heatsink for improved heat transfer
Weight White Thermal Paste
The StarTech HEATGREASE20 is a 20g tube of white ceramic-based compound designed to improve heat transfer between a CPU and heatsink. It uses silicone and metal oxide fillers to fill microscopic surface imperfections that trap air. The electrically non-conductive formula prevents short circuits if paste contacts surrounding components. It suits system builders and technicians performing CPU cooler installations or maintenance.
The paste dispenses from a tube directly onto the processor heat spreader for manual spreading or pressure mounting. Its ceramic-silicone consistency resists separation during storage and stays pliable during installation. Low bleed of under 0.05 percent after 24 hours at 200°C means minimal pump-out over thermal cycles. Evaporation loss stays below 0.001 percent under the same test, so reapplication intervals remain long.
Thermal conductivity reaches 1.066 W/mK with resistance under 0.195 °C-m2/W, suitable for stock and moderate overclocking scenarios. The material cannot match the heat flow of liquid metal or high-end carbon pastes used in extreme cooling. Builders targeting maximum frequency headroom on high-wattage CPUs will need higher-conductivity alternatives. The compound contains no electrically conductive metals, eliminating bridging risk on exposed dies or substrates.
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| Product | |
|---|---|
| Brand name | StarTech.com |
| Model name | HEATGREASE20 |
| Performance | |
| Thermal conductivity | 1.06 W/mK |
| Size & build | |
| Net content | 20g |
| Shipping weight | 0.03 kg |
| Package size | 149 × 84 × 25 mm |
Other versions of this model
Monitor CPU temperatures under load; effective heat transfer between the processor and heatsink should keep the CPU running cooler.
The tube holds 20g of white ceramic-based compound made of 50% silicone, 30% metal oxide and 20% carbon compounds; no spreader tool is included.
The 20g volume provides enough compound for several applications depending on the amount used per CPU.
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