ARCTIC COOLING ACTCP00002B MX-4 4 g thermal paste
- 4.0g
- 8.5 W/mK
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A 100×100×1.0 mm ceramic-silicone thermal pad with nano-aluminium oxide for CPUs, GPUs, RAM and consoles where paste cannot fill large gaps
The Thermal Grizzly Minus Pad 8 is a ceramic silicone and nano-aluminum oxide thermal pad measuring 100x100x1.0mm. It targets builders who need to bridge larger gaps between a heatsink and components such as VRAM, VRMs, or console APUs where paste cannot reach. The flexible structure conforms to uneven surfaces for reliable heat transfer. It suits PCs, laptops, MacBooks, and PlayStation or Xbox consoles.
This pad replaces thermal paste when the mating surfaces have a significant air gap or height difference that grease cannot fill effectively. The jump is worth it when the interface is too irregular for paste to maintain contact across the whole area. It is not suited for direct-die CPU or GPU cores where a thin layer of high-conductivity paste yields lower thermal resistance. Buyers who need the absolute thinnest bond line should use paste instead.
Installation requires only peeling the protective film and pressing the pad onto the clean component; no spreading tools or curing time are needed. The soft material compresses with light pressure to fill microscopic voids. Common issues include selecting a thickness that leaves the heatsink floating or choosing a pad that is too thin to bridge the actual gap. Measure the stack height carefully before ordering.
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No published specifications for this item yet.
The 100 mm square covers the PS5 main SoC area; trim with scissors if the console revision uses a smaller die.
Clean both surfaces with isopropyl alcohol, peel the liner, lay the pad down gently, then press the heatsink evenly — do not slide it.
Replace after 360 days of heavy load or whenever you disassemble the card; the silicone does not dry out but loses conformity over time.
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